基于多线耦合的互连串扰延时模型An interconnection crosstalk delay model based onmulti-line coupling
续朋,潘中良
摘要(Abstract)：
随着半导体的生产技术进入纳米级,大规模集成电路(VLSI)的集成度不断被提高。由于互连线之间的间距被迅速缩少,故互连线的耦合串扰效应已经严重影响了VLSI的整体性能。首先,提出一个三线耦合的等效电路模型,该模型结合了耦合电容和互感电感;其次,在该等效电路模型的基础上,通过运用解耦技术和ABCD参数矩阵的方法构造一个精确计算三线耦合的互连串扰延时模型;此外,还对比和分析了双线耦合和三线耦合的延时性能;最后,研究互连间距对串扰延时的影响。实验数据结果显示,采用非并行布线规则和增大互连间距均能有效降低串扰延时,提出的多根互连线的串扰延时模型和Spice仿真结果保持了高度的一致性。
关键词(KeyWords)： 大规模集成电路;互连耦合;串扰延时;解耦技术;ABCD参数矩阵;互连间距
基金项目(Foundation): 国家自然科学基金资助项目(61072028);; 广东省科学计划基金资助项目(2016B090918071);; 广州科学计划基金资助项目(201510010169);; 广东省国家自然科学基金资助项目(2014A030313441)~~
作者(Author): 续朋,潘中良
DOI: 10.16652/j.issn.1004-373x.2018.12.005
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