热与随机振动对车载电路板的影响研究Research on influence of heat and random vibration on vehicle-mounted circuit board
周嘉诚,刘芳,燕怒
摘要(Abstract):
研究汽车在行驶中发动机发热与振动两者共同作用对车载电路板组件产生的影响。运用有限元软件ANSYS对发动机模块电路板建模,温度场热应力分析,将应力结果导入模态分析和随机振动分析中,再比较电路板在常温与受热后的模态与随机振动结果。结果发现,电路板受热后固有频率提高,且其刚度增大,电路板变形减小。此外,该电路板组件应力最大点的统计应力值在第8阶频率下达到最大,且较常温相比,电路板受热后的功率谱曲线整体有所后移。通过随机疲劳计算,在热与振动影响下,该电路板结构满足疲劳要求。
关键词(KeyWords): 车载电路板;热应力;ANSYS;模态分析;随机振动;疲劳计算
基金项目(Foundation): 湖北省教育厅优秀中青年科技创新团队计划项目(T201607);湖北省教育厅科学研究计划青年人才项目资助(Q20141608);; 国家自然科学基金青年项目资助(11102141)~~
作者(Author): 周嘉诚,刘芳,燕怒
DOI: 10.16652/j.issn.1004-373x.2018.10.005
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