微机械可变电容制作工艺中的牺牲层释放和残余应力分析Release Process of Sacrificial and Analysis of Residual Stress in the MEMS Variable Capacitor Manufacture
李锐
摘要(Abstract)：
运用高选择比的特别配方来释放MEMS可变电容制作工艺中的牺牲层,以保护上级板金属铝层,同时很好地释放牺牲层磷硅玻璃。探讨了上级板的粘附问题,对工艺中影响成品率的关键因素残余应力进行了模拟,当温度T为350℃时,平面应力P为811.6 MPa;当温度T为500℃时,平面应力P为1 185.9 MPa。分析了残余应力对上级板的影响和对悬臂梁的等效弹性系数的影响。
关键词(KeyWords)： MEMS可变电容;牺牲层释放工艺;残余应力;磷硅玻璃
基金项目(Foundation):
作者(Author): 李锐
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